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Volumn 45, Issue 8, 2007, Pages 104-111

Can RF Help CMOS processors?

Author keywords

[No Author keywords available]

Indexed keywords

CMOS INTEGRATED CIRCUITS; CODE DIVISION MULTIPLE ACCESS; ELECTRIC LINES; MICROPROCESSOR CHIPS; PROGRAM PROCESSORS; TRANSISTORS;

EID: 34548657919     PISSN: 01636804     EISSN: None     Source Type: Journal    
DOI: 10.1109/MCOM.2007.4290322     Document Type: Article
Times cited : (31)

References (10)
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    • Design of Ion-implanted MOSFETs with Very Small Physical Dimensions
    • Oct
    • R. Dennard et al., "Design of Ion-implanted MOSFETs with Very Small Physical Dimensions," IEEE J. Solid State Circuits, vol. SC-9, no. 5, Oct. 1974, pp. 256-68.
    • (1974) IEEE J. Solid State Circuits , vol.SC-9 , Issue.5 , pp. 256-268
    • Dennard, R.1
  • 4
    • 34548624493 scopus 로고    scopus 로고
    • A Cost-Effective Latency-Aware Memory Bus for Shared-Memory Multi-Core Systems
    • to be published
    • J. Kim et al., "A Cost-Effective Latency-Aware Memory Bus for Shared-Memory Multi-Core Systems," IEEE Trans. Comp., to be published.
    • IEEE Trans. Comp
    • Kim, J.1
  • 5
    • 33646922057 scopus 로고    scopus 로고
    • The Future of Wires
    • R. Ho, K. W. Mai, and M. A. Horowitz, "The Future of Wires," Proc. IEEE, vol. 89, no. 4, 2001, pp. 490-504.
    • (2001) Proc. IEEE , vol.89 , Issue.4 , pp. 490-504
    • Ho, R.1    Mai, K.W.2    Horowitz, M.A.3
  • 7
    • 28144433018 scopus 로고    scopus 로고
    • An RF/Baseband FDMA-Interconnect Transceiver for Reconfigurable Multiple Access Chip-to-Chip Communication
    • Feb
    • J. Ko et al., "An RF/Baseband FDMA-Interconnect Transceiver for Reconfigurable Multiple Access Chip-to-Chip Communication," ISSCC Dig. Tech. Pap., Feb. 2005, pp. 338-39.
    • (2005) ISSCC Dig. Tech. Pap , pp. 338-339
    • Ko, J.1
  • 8
    • 34548642840 scopus 로고    scopus 로고
    • A. J. Viterbi, CDMA Principles of Spread Spectrum Communication, Communication Series, Addison-Wesley, June 1995.
    • A. J. Viterbi, CDMA Principles of Spread Spectrum Communication, Communication Series, Addison-Wesley, June 1995.
  • 9
    • 3142547915 scopus 로고    scopus 로고
    • RF/wireless Interconnect for Interand Intra-Chip Communications
    • Apr
    • M. F. Chang et al., "RF/wireless Interconnect for Interand Intra-Chip Communications," Proc. IEEE, vol. 89, no. 4, Apr. 2001, pp. 456-66.
    • (2001) Proc. IEEE , vol.89 , Issue.4 , pp. 456-466
    • Chang, M.F.1
  • 10
    • 34548643745 scopus 로고    scopus 로고
    • Two Gb/s/pin Low-Power Interconnect Methods for 3D ICs
    • Feb
    • Q. Gu et al., "Two Gb/s/pin Low-Power Interconnect Methods for 3D ICs," ISSCC Dig. Tech. Pap., Feb. 2007, pp. 448-49.
    • (2007) ISSCC Dig. Tech. Pap , pp. 448-449
    • Gu, Q.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.