Electrodeposition of amorphous gold alloy films

Electrochimica Acta

Volumn 53, Issue 1, 2007, Pages 11-15

  Kato, Masaru ^a,b   Senda, Kazutaka ^a,b   Musha, Yuta ^b   Sasano, Junji ^b   Okinaka, Yutaka ^b   Osaka, Tetsuya ^b  

^a KANTO CHEMICAL CO INC   (Japan)

^b WASEDA UNIVERSITY   (Japan)

Author keywords

Amorphous gold cobalt alloy; Amorphous gold nickel alloy; Cobalt tungsten alloy; Electroplating; Nickel tungsten alloy

Indexed keywords

AMORPHOUS MATERIALS; CONCENTRATION (PROCESS); CRYSTALLINE MATERIALS; ELECTRODEPOSITION; GOLD; MICROSTRUCTURE; X RAY DIFFRACTION ANALYSIS;

ALLOY PLATING PROCESS; AMORPHOUS GOLD COBALT ALLOY; AMORPHOUS GOLD NICKEL ALLOY; NICKEL TUNGSTEN ALLOY;

METALLIC FILMS;

EID: 34548594210     PISSN: 00134686     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.electacta.2007.01.045     Document Type: Article

References (2)

1. Togasaki N., Okinaka Y., Homma T., and Osaka T. Electrochim. Acta 51 (2005) 882
2. Omi T., Nishido K., Matsumoto H., and Yamamoto H. Hyomen Gijutu (J. Surf. Fin. Soc. Jpn.) 40 (1989) 1287