Preparation of high dispersed nickel pastes for thick film electrodes

Journal of Materials Science

Volumn 41, Issue 19, 2006, Pages 6425-6430

  Im, D H ^a   Hyun, S H ^a   Park, S Y ^a   Lee, B Y ^b   Kim, Y H ^b  

^a Yonsei University   (South Korea)

^b Chang Sung Corporation   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

BALL MILLING; ELECTRODES; MICROSTRUCTURE; NICKEL; POWDERS; SURFACE ROUGHNESS; THICK FILM DEVICES;

DISPERSANTS; ETHYL CELLULOSE; THICK FILM ELECTRODES;

MULTILAYERS;

EID: 34548559531     PISSN: 00222461     EISSN: 15734803     Source Type: Journal    
DOI: 10.1007/s10853-006-0715-2     Document Type: Article

References (10)

1. Ueyama R, Ueyama T, Koumoto K, Kuribayashi K (2001) J Ceram Soc Jpn 109(8):661
2. Ueyama R, Seki N, Kamada K, Harada M, Ueyama T (1999) J Ceram Soc Jpn 107(7):652
3. Yamamatsu J, Kawano N, Arashi T, Sato A, Nakano Y, Nomura T (1996) J Power Sources 60:199
4. Zheng H, Liang J, Zeng J, Qian Y (2001) Mater Res Bull 36:947
5. Gao J, Guan F, Zhao Y, Yang W, Ma Y, Lu X, Hou J, Kang J (2001) Mater Chem Phys 71:215
6. Chou KS, Huang KC (2001) J Nanoparticle Res 3:127
7. Im DH, Hyun SH, Park SY, Lee BY, Kim YH Mater. Sci. Eng. A (under review)
8. Patton TC (1968) J Paint Technol 40(522):301
9. Sun J, Gao L, Guo J (1998) J Nanostruct Mater 10(6):1081
10. Lin JC, Wang CY (1996) Mater Chem Phys 45:253