Direct measurement of mechanical properties of Bi2223 filament using Ag alloy removed tape

Physica C: Superconductivity and its Applications

Volumn 463-465, Issue SUPPL., 2007, Pages 863-866

  Hojo, M ^a   Hashimoto, M ^a   Tanaka, M ^a   Adachi, T ^a   Sugano, M ^a   Ochiai, S ^a   Osamura, K ^b  

^a KYOTO UNIVERSITY   (Japan)

^b RESEARCH INSTITUTE FOR APPLIED SCIENCES   (Japan)

Author keywords

Bi2223; Filament Young's modulus; Fracture strain; Superconducting composite tape

Indexed keywords

BISMUTH ALLOYS; ELASTIC MODULI; FRACTURE TOUGHNESS; SILVER ALLOYS; STRAIN HARDENING; YIELD STRESS;

FILAMENT YOUNG'S MODULUS; FRACTURE STRAIN; SUPERCONDUCTING COMPOSITE TAPES; VOLUME FRACTIONS;

SUPERCONDUCTING TAPES;

EID: 34548479537     PISSN: 09214534     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.physc.2007.03.494     Document Type: Article

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