Industrial applications and opportunities for nondestructive evaluation of structural wood members

Maderas: Ciencia y Tecnologia

Volumn 9, Issue 2, 2007, Pages 127-134

  Beall, Frank C ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

Adhesive bonding; Adhesive curing; Density; Grading; Grain orientation; Internal defect scanning; Mechanical properties; Microwave; Moisture content; Radiation

Indexed keywords

EID: 34548359204     PISSN: 07173644     EISSN: 0718221X     Source Type: Journal    
DOI: None     Document Type: Review

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