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Volumn 43, Issue 18, 2007, Pages 978-980

Highly efficient manifold microchannel heatsink

Author keywords

[No Author keywords available]

Indexed keywords

ENERGY EFFICIENCY; FLOW RATE; HEAT FLUX; HEAT TRANSFER; MICROCHANNELS;

EID: 34548303991     PISSN: 00135194     EISSN: None     Source Type: Journal    
DOI: 10.1049/el:20071325     Document Type: Article
Times cited : (8)

References (6)
  • 1
    • 0019563707 scopus 로고
    • High-performance heat sinking for VLSI
    • 0741-3106
    • Pease, R.F.W., and Tuckerman, D.B.: ' High-performance heat sinking for VLSI ', IEEE Electron Device Lett., 1981, 2, p. 126-129 0741-3106
    • (1981) IEEE Electron Device Lett. , vol.2 , pp. 126-129
    • Pease, R.F.W.1    Tuckerman, D.B.2
  • 2
    • 33645765342 scopus 로고    scopus 로고
    • Thermal-hydraulic performance of MEMS-based pin fin heatsink
    • 10.1115/1.2137760 0022-1481
    • Kosar, A., and Peles, Y.: ' Thermal-hydraulic performance of MEMS-based pin fin heatsink ', Trans. ASME, C, J. Heat Transf., 2006, 128, p. 121-131 10.1115/1.2137760 0022-1481
    • (2006) Trans. ASME, C, J. Heat Transf. , vol.128 , pp. 121-131
    • Kosar, A.1    Peles, Y.2
  • 4
    • 17644390169 scopus 로고    scopus 로고
    • Microscale heat transfer enhancement using thermal boundary layer redeveloping concept
    • 10.1016/j.ijheatmasstransfer.2004.12.008 0017-9310
    • Xu, J.L., Gan, Y.H., Zhang, D.C., and Li, X.H.: ' Microscale heat transfer enhancement using thermal boundary layer redeveloping concept ', Int. J. Heat Mass Transf., 2005, 48, p. 1662-1674 10.1016/j.ijheatmasstransfer.2004. 12.008 0017-9310
    • (2005) Int. J. Heat Mass Transf. , vol.48 , pp. 1662-1674
    • Xu, J.L.1    Gan, Y.H.2    Zhang, D.C.3    Li, X.H.4
  • 5
    • 0031170195 scopus 로고    scopus 로고
    • Manifold microchannel heat sinks: Isothermal analysis
    • 10.1109/95.588554 1070-9886
    • Copeland, D., Behnia, M., and Nakayama, W.: ' Manifold microchannel heat sinks: isothermal analysis ', IEEE Trans. Compon. Packag. Manuf. Technol. A, 1997, 20, p. 96-102 10.1109/95.588554 1070-9886
    • (1997) IEEE Trans. Compon. Packag. Manuf. Technol. A , vol.20 , pp. 96-102
    • Copeland, D.1    Behnia, M.2    Nakayama, W.3
  • 6
    • 0033337616 scopus 로고    scopus 로고
    • Phase change in microchannel heat sinks with integrated temperature sensors
    • 10.1109/84.809049 1057-7157
    • Jiang, L.A., Wong, M., and Zohar, Y.: ' Phase change in microchannel heat sinks with integrated temperature sensors ', J. Microelectromech. Syst., 1999, 8, p. 358-365 10.1109/84.809049 1057-7157
    • (1999) J. Microelectromech. Syst. , vol.8 , pp. 358-365
    • Jiang, L.A.1    Wong, M.2    Zohar, Y.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.