Behavior of anisotropic conductive film joints bonded with various forces under temperature fluctuation

Journal of Electronic Materials

Volumn 36, Issue 9, 2007, Pages 1199-1205

  Kim, Jong Woong ^a   Jung, Seung Boo ^a  

^a Sungkyunkwan University   (South Korea)

Author keywords

Anisotropic conductive film; Bonding force; Flip chip; Reliability

Indexed keywords

ANISOTROPIC CONDUCTIVE FILM (ACF); BONDING FORCES; FLEXIBLE SUBSTRATES; NON-CONDUCTIVE GAPS;

ANISOTROPY; FLIP CHIP DEVICES; RELIABILITY THEORY; SUBSTRATES; THERMAL CONDUCTIVITY; THERMAL SHOCK;

CONDUCTIVE FILMS;

EID: 34548288575     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-007-0191-8     Document Type: Article

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