Micro line conductor structuring using electro-hydrodynamic printing of silver nano suspension

Proceedings - 2005 International Symposium on Microelectronics, IMAPS 2005

Volumn , Issue , 2005, Pages 625-631

  Lee, Dae Young ^a   Hwang, Eun Soo ^a   Kim, Yong Jun ^a   Hwang, Jungho ^a  

^a Yonsei University   (South Korea)

Author keywords

Curing; Direct write technology; Electro hydrodynamic printing; Electrospray; Printed circuit board; Silver nano suspension

Indexed keywords

CONFOCAL LASER SCANNING MICROSCOPE; DIRECT-WRITE TECHNOLOGY; ELECTRICAL POTENTIAL; ELECTROSPRAYS; METALLIC PARTICLES; NANO-SUSPENSIONS; NANOPARTICLE SUSPENSION; SILVER NANOPARTICLES;

CURING; DEPOSITS; ELECTROHYDRODYNAMICS; FLUID DYNAMICS; MICROELECTRONICS; NANOPARTICLES; NOZZLES; PHASE INTERFACES; POLYIMIDES; POLYMERIC FILMS; PRINTED CIRCUIT BOARDS; PRINTING;

SILVER;

EID: 34548067325     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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