Analysis of diffusion mechanism of Cu in polycrystalline Bi 2Te3-based alloy with the aging of electrical conductivity

Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 46, Issue 8 A, 2007, Pages 5033-5039

  Fujimoto, Shinichi ^a   Sano, Seijirou ^a   Kajitani, Tsuyoshi ^b  

^a KOMATSU LTD   (Japan)

^b TOHOKU UNIVERSITY   (Japan)

Author keywords

Bi2Te4; Cu; Diffusion; Thermoelectric materials

Indexed keywords

AGING OF MATERIALS; COPPER; DIFFUSION; ELECTRIC CONDUCTIVITY; POLYCRYSTALLINE MATERIALS; THERMOELECTRICITY;

AGING TIME; BI2TE4; THERMOELECTRIC MATERIALS;

SEMICONDUCTING BISMUTH COMPOUNDS;

EID: 34547899549     PISSN: 00214922     EISSN: 13474065     Source Type: Journal    
DOI: 10.1143/JJAP.46.5033     Document Type: Article

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