Wafer-level packaging for micro-electro-mechanical systems using surface activated bonding

Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 46, Issue 4 B, 2007, Pages 2768-2770

  Takegawa, Yoshiyuki ^a   Baba, Toru ^a   Okudo, Takafumi ^a   Suzuki, Yuji ^a  

^a PANASONIC CORPORATION   (Japan)

Author keywords

Airtightness; Bonding; MEMS; Micro electro mechanical systems; Raman; Roomtemperature bonding; Sensor; Stress; Surface activated bonding; Wafer level packaging

Indexed keywords

ACOUSTIC MICROSCOPES; BIOSENSORS; COST REDUCTION; DIAPHRAGMS; RAMAN SPECTROSCOPY; TRANSMISSION ELECTRON MICROSCOPY;

DOWNSIZING; EUTECTIC BONDING; MECHANICAL DAMAGE; SURFACE ACTIVATED BONDING (SAB); WAFER-LEVEL PACKAGING;

MEMS;

EID: 34547857827     PISSN: 00214922     EISSN: 13474065     Source Type: Journal    
DOI: 10.1143/JJAP.46.2768     Document Type: Article

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