Temperature-dependent elastic moduli of epoxies measured by DMA and their correlations to mechanical testing data

Polymer Testing

Volumn 26, Issue 6, 2007, Pages 803-813

  Deng, Shiqiang ^a   Hou, Meng ^b   Ye, Lin ^a  

^a UNIVERSITY OF SYDNEY   (Australia)

^b Cooperative Research Centre for Advanced Composite Structures ^*  (Australia)

Author keywords

Dynamic mechanical analysis (DMA); Epoxy; Temperature dependant modulus

Indexed keywords

DYNAMIC MECHANICAL ANALYSIS; ELASTIC MODULI; MECHANICAL TESTING; NANOCOMPOSITES; SILICA; THERMAL GRADIENTS;

DRIVE AMPLITUDE; LOADING MODES; TEMPERATURE-DEPENDANT ELASTIC MODULI;

EPOXY RESINS;

EID: 34547691635     PISSN: 01429418     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.polymertesting.2007.05.003     Document Type: Article

References (8)

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