Diffusion bonding of Ti/graphite and Ti/diamond by hot isostatic pressing method

Journal of Materials Processing Technology

Volumn 192-193, Issue , 2007, Pages 453-458

  Tanabe, J ^a   Sasaki, T ^b   Kishi, S ^c  

^a NIPPON INSTITUTE OF TECHNOLOGY   (Japan)

^b Japan AE Power Systems Corporation   (Japan)

^c Saitama Fuji   (Japan)

Author keywords

Diamond; Diffusion bonding; Graphite; Hot isostatic pressing; Joining; Titanium

Indexed keywords

DIAMONDS; DIFFUSION BONDING; GRAPHITE; HOT ISOSTATIC PRESSING; TENSILE STRENGTH; TITANIUM; JOINING; PRESSURIZATION; TENSILE TESTING; TITANIUM CARBIDE;

COLD ISOSTATIC PRESSURE (CIP); CONTACT INTERFACE; DIFFUSION JOINING;

MATERIALS SCIENCE; DIFFUSION;

COLD ISOSTATIC PRESSURE; CONTACT INTERFACE; DIFFUSION COUPLE; DIFFUSION JOINING; DIFFUSION LAYERS; DIFFUSION MECHANISMS; HOT ISOSTATIC PRESSURE; ISOSTATIC PRESSING METHODS;

EID: 34547537205     PISSN: 09240136     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jmatprotec.2007.04.014     Document Type: Article

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