Improvement of fabrication process for 10-kA/cm multi-layer Nb integrated circuits

IEEE Transactions on Applied Superconductivity

Volumn 17, Issue 2, 2007, Pages 169-172

  Satoh, Tetsuro ^a   Hinode, Kenji ^a   Nagasawa, Shuichi ^a   Kitagawa, Yoshihiro ^a   Hidaka, Mutsuo ^a  

^a SUPERCONDUCTIVITY RESEARCH LABORATORY   (Japan)

Author keywords

Integrated circuit fabrication; Josephson device fabrication; Niobium; Superconducting integrated circuits

Indexed keywords

FILM THICKNESS; JOSEPHSON JUNCTION DEVICES; MICROFABRICATION; MULTILAYERS; NIOBIUM; STRAIN; TEMPERATURE MEASUREMENT;

INTEGRATED CIRCUIT FABRICATION; JOSEPHSON DEVICE FABRICATION; SUPERCONDUCTING INTEGRATED CIRCUITS;

INTEGRATED CIRCUITS;

EID: 34547474261     PISSN: 10518223     EISSN: None     Source Type: Journal    
DOI: 10.1109/TASC.2007.897871     Document Type: Conference Paper

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