Current leads and optimized thermal packaging for superconducting systems on multistage cryocoolers

IEEE Transactions on Applied Superconductivity

Volumn 17, Issue 2, 2007, Pages 975-978

  Kadin, Alan M ^a   Webber, Robert J ^a   Gupta, Deepnarayan ^a  

^a HYPRES INC   (United States)

Author keywords

Cryocooler; Cryopackaging; Current leads; Thermal optimization

Indexed keywords

GEOMETRY; HEAT TRANSFER; OPTIMIZATION; SPECIFIC HEAT; SUPERCONDUCTING DEVICES; THERMAL LOAD;

CRYOPACKAGING; MULTISTAGE CRYOCOOLERS; SIGNAL ATTENUATION; SUPERCONDUCTING ELECTRONIC SYSTEMS;

ELECTRONICS PACKAGING;

EID: 34547447206     PISSN: 10518223     EISSN: None     Source Type: Journal    
DOI: 10.1109/TASC.2007.898719     Document Type: Conference Paper

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