Control relevant issues in semiconductor manufacturing: Overview with some new results

Control Engineering Practice

Volumn 15, Issue 10 SPEC. ISS., 2007, Pages 1268-1279

  Su, An Jhih ^a   Jeng, Jyh Cheng ^a   Huang, Hsiao Ping ^a   Yu, Cheng Ching ^a   Hung, Shih Yu ^b   Chao, Ching Kong ^c  

^a NATIONAL TAIWAN UNIVERSITY   (Taiwan)

^b NAN KAI UNIVERSITY OF TECHNOLOGY   (Taiwan)

^c NATIONAL TAIWAN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Taiwan)

Author keywords

Control structure design; Process systems engineering; Rapid thermal processing; Semiconductor manufacturing; Virtual metrology; Wafer acceptance test

Indexed keywords

CONTROL SYSTEM SYNTHESIS; FEEDBACK CONTROL; INTEGRATED CIRCUITS; RAPID THERMAL PROCESSING; SEMICONDUCTOR DEVICE MANUFACTURE; TIME SERIES ANALYSIS; WAFER BONDING;

PROCESS SYSTEM ENGINEERING; RUN-TO-RUN CONTROLLER; VIRTUAL METROLOGY;

PROCESS CONTROL;

CONTROL SYSTEM SYNTHESIS; FEEDBACK CONTROL; INTEGRATED CIRCUITS; PROCESS CONTROL; RAPID THERMAL PROCESSING; SEMICONDUCTOR DEVICE MANUFACTURE; TIME SERIES ANALYSIS; WAFER BONDING;

EID: 34547433202     PISSN: 09670661     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.conengprac.2006.11.003     Document Type: Article

References (38)

1. Boley B.A., and Weiner J.H. Theory of thermal stresses (1960), Wiley, New York
2. Campbell S.A., and Knutson K.L. Transient effects in rapid thermal processing. IEEE Transactions on Semiconductor Manufacturing 5 (1992) 302
3. Chao C.K., Hung S.Y., and Yu C.C. Thermal stress analysis for rapid thermal processor. IEEE Transactions on Semiconductor Manufacturing 13 (2003) 335
4. Chao C.K., Hung S.Y., and Yu C.C. Effect of lamp radius on thermal stresses for rapid thermal processing system. ASME Journal of Manufacturing Science and Engineering 125 (2003) 504
5. Chen A., and Guo R.S. Age-based double EWMA controller and its application to CMP processes. IEEE Transactions on Semiconductor Manufacturing 14 (2001) 11
6. Chen Y.H., Shiu S.J., Yu C.C., and Shen S.H. Batch sequencing for run-to-run control: Application to chemical mechanical polishing. Industrial and Engineering Chemistry Research 44 (2005) 4676
7. Cho M., Lee Y., Joo S., and Lee K.S. Semi-empirical model-based multivariable iterative learning control of an RTP system. IEEE Transactions on Semiconductor Manufacturing. 18 (2005) 430
8. Dassau E., Grosman B., and Lewin D.R. Modeling and temperature control of rapid thermal processing. Computers and Chemical Engineering 30 (2006) 686
9. Edgar, T.F. (2004). Multi-product run-to-run control for high-mix fabs. AEC/APC symposium. HsinChu, Asia, December.
10. Edgar T.F., Butler S.W., Campbell W.J., Pfeiffer C., Bode C., Hwang S.B., et al. Automatic control of microelectronics manufacturing: Practices, challenges and possibilities. Automatica 36 (2000) 1567
11. Fan C.M., Guo R.S., Chang S.C., and Wei C.S. SHEWMA: An end-of-line SPC scheme using wafer acceptance test data. IEEE Transactions on Semiconductor Manufacturing 13 (2000) 344
12. Fan Y.H., and Qiu T. Analyses of thermal stresses and control schemes for fast temperature ramps of batch furnaces. IEEE Transactions on Semiconductor Manufacturing 10 (1997) 433
13. Gunawan R., Jung M.Y.L., Seebauer E.G., and Braatz R.D. A maximum a posteriori estimation of transient enhanced diffusion energetics. American Institute of Chemical Engineers 49 (2003) 2114
14. Gunawan R., Jung M.Y.L., Seebauer E.G., and Braatz R.D. Optimal control of rapid thermal annealing in a semiconductor process. Journal of Process Control 14 (2004) 423
15. Hebb J.P., and Jensen K.F. The effect of patterns on thermal stress during rapid thermal processing of silicon wafers. IEEE Transactions on Semiconductor Manufacturing 11 (1998) 99
16. Huang C.J., Yu C.C., and Shen S.H. Selection of measurement location for the control of rapid thermal processor. Automatica 36 (2000) 705
17. Huang C.J., Yu C.C., and Shen S.H. Identification and nonlinear control for rapid thermal processor. Journal of Chinese Institute of Chemical Engineers 31 (2000) 585
18. Huang I., Liu H.H., and Yu C.C. Design for control: Temperature uniformity in rapid thermal processor. Korean Journal of Chemical Engineering 17 (2000) 111
19. Hsu, C.W., Hung, M.Y., Chen, B.C., Cheng, Y.J., Hsu, C., & Lai, J.H. (2004). The challenges of implementing APC in foundry. AEC/APC symposium. USA XVI, Westminster, CO, September.
20. Jung M.Y., Gunawan R., Braatz R.D., and Seebauer E.G. Ramp-rate effects on transient enhanced diffusion and dopant activation. Journal of the Electrochemical Society 150 (2003) G838
21. Jung M.Y., Gunawan R., Braatz R.D., and Seebauer E.G. A simplified picture for transient enhanced diffusion of boron in silicon. Journal of the Electrochemical Society 151 (2004) G1
22. Kourti T. Multivariate dynamic data modeling for analysis and statistical process control of batch processes, start-up and grade transitions. Journal of Chemometrics 17 (2003) 93
23. Kourti T., Nomikos P., and MacGregor J.F. Analysis, monitoring and fault diagnosis of batch processes using multiblock and multiway PLS. Journal of Process Control 5 (1995) 277
24. Lee K.S., Lee J., Chin I., Choi J., and Lee J.H. Control of wafer temperature uniformity in rapid thermal processing using an optimal iterative learning control technique. Industrial and Engineering Chemistry Research 40 (2001) 1661
25. Lewin, D.R., Lachman-Shalem, S., & Grosman, B. (2006). The role of process system engineering (PSE) Applications in integrated circuit (IC) manufacturing, Control Engineering Practice (doi:10.1016/j.conengprac.2006.04.003).
26. Lord H.A. Thermal and stress analysis of semiconductor wafers in a rapid thermal processing oven. IEEE Transactions on Semiconductor Manufacturing 1 (1988) 105
27. Louwerse D.J., and Smilde A.K. Multivariate statistical process control of batch processes based on three-way models. Chemical Engineering Science 55 (2000) 1255
28. Morari M., and Zafiriou E. Robust process control (1989), Prentice-Hall, Englewood Cliffs, NJ
29. Nomikos P., and MacGregor J.F. Monitoring of batch processes using multi-way principle component analysis. American Institute of Chemical Engineers 40 (1994) 1361
30. Nowinski J.L. Theory of thermoelasticity with application (1978), Sijthoff and Noordhoff
31. Patel N.S., Miller G.A., Guinn C., and Jenkins S.T. Device dependent control of chemical-mechanical polishing of dielectric films. IEEE Transactions on Semiconductor Manufacturing 13 (2000) 331
32. Qin, S.J., Cherry, G., Good, R., Wang, J., & Harrison, C.A. (2004). Control and monitoring of semiconductor manufacturing processes: Challenges and opportunities. DYCOPS-7, Boston, July.
33. Qin S.J., Scheid G.W., and Riley T.J. Adaptive run-to-run control and monitoring for a rapid thermal processor. Journal of Vacuum Science and Technology B 21 (2003) 301-310
34. Sachs E., Hu A., and Ingolfsson A. Run by run process control: combining SPC and feedback control. IEEE Transactions on Semiconductor Manufacturing 8 (1995) 26
35. Wang, T. (2004). Advanced process control road map and challenges. AEC/APC symposium. HsinChu, Asia, December.
36. Wise B.M., Gallagher N.B., Butler S.W., White D.D., and Barna G.G. A comparison of principal component analysis, multiway principal component analysis, trilinear decomposition and parallel factor analysis for fault detection in semiconductor etch process. Journal of Chemometrics 13 (1999) 379
37. Wu, S., Chen, P.H., Lin, J.S., Ko, F., Lo, H., Wang, J., et al. (2005). Real-time device performance prediction for 90 nm and beyond. AEC/APC symposium. Palm Spring, CA, USA, September.
38. Young G.L., and McDonald K.A. Effect of radiation shield angle on temperature and stress profiles during rapid thermal annealing. IEEE Transactions on Semiconductor Manufacturing 3 (1990) 176