Microstructural characterization of Al/Mg alloy interdiffusion mechanism during accumulative roll bonding

Metals and Materials International

Volumn 13, Issue 3, 2007, Pages 201-205

  Chen, Ming Che ^a   Hsieh, Chih Chun ^a   Wu, Weite ^a  

^a NATIONAL CHUNG HSING UNIVERSITY   (Taiwan)

Author keywords

Al Mg alloy; ARB; Diffusion; Intermetallic compound

Indexed keywords

BINARY ALLOYS; DIFFUSION; ELECTRON PROBE MICROANALYSIS; INTERMETALLICS; MAGNESIUM ALLOYS; ROLL BONDING;

ACCUMULATIVE ROLL BONDING; ACCUMULATIVE ROLL BONDING (ARB) PROCESS; ATOMIC DIFFUSIONS; BONDING CHARACTERISTICS; DEPTH CURVE; DIFFUSION COUPLE; DIFFUSION ZONES; MICRO-STRUCTURAL CHARACTERIZATION;

ALUMINUM ALLOYS;

EID: 34547402020     PISSN: 15989623     EISSN: None     Source Type: Journal    
DOI: 10.1007/BF03027805     Document Type: Article

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