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Volumn 17, Issue 2, 2007, Pages 3079-3082

Electromechanical and thermal properties of Bi2223 tapes

Author keywords

Bi2223 superconducting tapes; Critical current; Strain measurement; Thermal conductivity; Thermal expansion

Indexed keywords

CRITICAL CURRENTS; ELECTRIC PROPERTIES; ELECTROMECHANICAL DEVICES; HIGH TEMPERATURE SUPERCONDUCTORS; STRAIN MEASUREMENT; THERMAL CONDUCTIVITY; THERMAL EXPANSION;

EID: 34547400471     PISSN: 10518223     EISSN: None     Source Type: Journal    
DOI: 10.1109/TASC.2007.899365     Document Type: Conference Paper
Times cited : (18)

References (4)
  • 1
    • 0141829231 scopus 로고    scopus 로고
    • Estimation of the coefficient of thermal expansion of Bi2223 at low temperature
    • M. Sugano, K. Osamura, and A. Nyilas, "Estimation of the coefficient of thermal expansion of Bi2223 at low temperature," Supercond. Sci. Technol., vol. 16, pp. 1064-1070, 2003.
    • (2003) Supercond. Sci. Technol , vol.16 , pp. 1064-1070
    • Sugano, M.1    Osamura, K.2    Nyilas, A.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.