Temperature dependence of elastic moduli in bulk metallic glasses down to liquid nitrogen temperature

Applied Physics Letters

Volumn 90, Issue 25, 2007, Pages

  Yu, Peng ^a   Wang, R J ^a   Zhao, D Q ^a   Bai, H Y ^a  

^a INSTITUTE OF PHYSICS   (China)

Author keywords

[No Author keywords available]

Indexed keywords

DEBYE TEMPERATURE; ELASTIC MODULI; LIQUID NITROGEN; SPECIFIC HEAT; THERMAL EFFECTS;

BULK METALLIC GLASSES; TEMPERATURE DEPENDENCE; VARSHNI EXPRESSION;

METALLIC GLASS;

EID: 34547381914     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2749838     Document Type: Article

References (23)

1. W. H. Wang, Prog. Mater. Sci. 52, 540 (2007).
2. A. L. Greer, Science 267, 1947 (1995).
3. Y. H. Liu, G. Wang, R. J. Wang, D. Q. Zhao, and W. H. Wang, Science 315, 1385 (2007).
4. J. J. Lewandowski, W. H. Wang, and A. L. Greer, Philos. Mag. Lett. 85, 77 (2005);
5. G. J. Fan, M. Freels, H. Choo, P. K. Liaw, W. K. Rhim, W. L. Johnson, P. Yu, and W. H. Wang, Appl. Phys. Lett. 89, 241917 (2006).
6. W. H. Wang and R. J. Wang, Appl. Phys. Lett. 74, 1803 (1999);
7. E. Schreiber, Elastic Constants and Their Measurement (McGraw-Hill, New York, 1973).
8. F. Spaepen, Acta Metall. 25, 407 (1977).
9. J. Lu, G. Ravichandran, and W. L. Johnson, Acta Mater. 51, 3429 (2003).
10. B. Zhang, D. Q. Zhao, M. X. Pan, W. H. Wang, and A. L. Greer, Phys. Rev. Lett. 94, 205502 (2005).
11. W. H. Wang, J. Appl. Phys. 99, 093506 (2006).
12. F. Augereau, D. Laux, L. Allais, M. Mottot, and C. Caes, Ultrasonics 46, 34 (2007).
13. K. Tanaka, T. Ichitsubo, and E. Matsubara, Mater. Sci. Eng., A 442, 278 (2006).
14. Y. P. Varshni, Phys. Rev. B 2, 3952 (1970).
15. H. Ledbett, Materials at Low Temperature (American Society for Metals, Metals Park, OH, 1983).
16. H. Ledbetter, Phys. Status Solidi B 181, 81 (1994).
17. R. J. Wang, W. H. Wang, and L. M. Wang, J. Phys.: Condens. Matter 15, 603 (2003).
18. L. A. Girifalco, Statistical Physical of Materials (Wiley, New York, 1973).
19. J. N. Murrell and S. F. Kettle, The Chemical Bond (Wiley, New York, 1985).
20. P. Lunkenheimer, U. Schneider, R. Brand, and A. Loidl, Contemp. Phys. 41, 15 (2000);
21. Z. F. Zhao, P. Wen, C. H. Shek, and W. H. Wang, Phys. Rev. B 75, 174201 (2007).
22. H. Q. Li, C. Fan, K. X. Tao, H. Choo, and P. K. Liaw, Adv. Mater. (Weinheim, Ger.) 18, 752 (2006).
23. X. J. Gu, A. G. McDermott, S. J. Poon, and G. J. Shiflet, Appl. Phys. Lett. 88, 211905 (2006).