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Volumn , Issue , 2007, Pages 497-502

Confidence scalable post-silicon statistical delay prediction under process variations

Author keywords

Post silicon optimization; Statistical timing analysis

Indexed keywords

POST-SILICON OPTIMIZATION; PROCESS VARIATIONS; STANDARD DEVIATION; STATISTICAL TIMING ANALYSIS;

EID: 34547322816     PISSN: 0738100X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/DAC.2007.375216     Document Type: Conference Paper
Times cited : (20)

References (9)
  • 1
    • 0346778721 scopus 로고    scopus 로고
    • Statistical Timing Analysis Considering Spatial Correlations using a Single Pert-Like Traversal
    • H. Chang and S. S. Sapatnekar. Statistical Timing Analysis Considering Spatial Correlations using a Single Pert-Like Traversal . In Proc. IEEE/ACM ICCAD, pp. 621-625, 2003.
    • (2003) Proc. IEEE/ACM ICCAD , pp. 621-625
    • Chang, H.1    Sapatnekar, S.S.2
  • 2
    • 4444233012 scopus 로고    scopus 로고
    • First-Order Incremental Block-Based Statistical Timing Analysis
    • June
    • C. Visweswariah et al. First-Order Incremental Block-Based Statistical Timing Analysis . In Proc. ACM/IEEE DAC, pp. 331-336, June 2004.
    • (2004) Proc. ACM/IEEE DAC , pp. 331-336
    • Visweswariah, C.1
  • 3
    • 0141649464 scopus 로고    scopus 로고
    • Path-Based Statistical Timing AnalysisConsidering Inter- and Intra-die Correlations
    • A. Agarwal et al. Path-Based Statistical Timing AnalysisConsidering Inter- and Intra-die Correlations . In Proc. TAU, pp. 16-21, 2002.
    • (2002) Proc. TAU , pp. 16-21
    • Agarwal, A.1
  • 4
    • 27644526873 scopus 로고    scopus 로고
    • Statistical Timing Analysis under Spatial Correlations
    • Sep
    • H. Chang and S. S. Sapatnekar. Statistical Timing Analysis under Spatial Correlations . In IEEE Trans. on CAD, vol. 24, pp. 1467-1482, Sep. 2005.
    • (2005) IEEE Trans. on CAD , vol.24 , pp. 1467-1482
    • Chang, H.1    Sapatnekar, S.S.2
  • 5
    • 0036858210 scopus 로고    scopus 로고
    • Adaptive Body Bias for Reducing Impacts of Die-to-Die and Within-Die Parameter Variations onMicroprocessor Frequency and Leakage
    • Nov
    • J. Tschanz et al. Adaptive Body Bias for Reducing Impacts of Die-to-Die and Within-Die Parameter Variations onMicroprocessor Frequency and Leakage . In IEEE Journal of Solid-State Circuits, vol. 37, pp. 1396-1402, Nov. 2002.
    • (2002) IEEE Journal of Solid-State Circuits , vol.37 , pp. 1396-1402
    • Tschanz, J.1
  • 6
    • 0038528639 scopus 로고    scopus 로고
    • Effectiveness of Adaptive Supply Voltage and Body Bias for Reducing the Impact of Parameter Variations in Low Power and High Performance Microprocessors
    • May
    • J. Tschanz et al. Effectiveness of Adaptive Supply Voltage and Body Bias for Reducing the Impact of Parameter Variations in Low Power and High Performance Microprocessors . In IEEE Journal of Solid-State Circuits, vol. 38, pp. 826-829, May 2003.
    • (2003) IEEE Journal of Solid-State Circuits , vol.38 , pp. 826-829
    • Tschanz, J.1
  • 7
    • 39749185147 scopus 로고    scopus 로고
    • Adaptive Circuit Techniques to Minimize Variation Impacts on Microprocessor Performance and Power
    • May
    • J. Tschanz et al. Adaptive Circuit Techniques to Minimize Variation Impacts on Microprocessor Performance and Power . In Proc. IEEE ISCAS, pp. 23-26, May 2005.
    • (2005) Proc. IEEE ISCAS , pp. 23-26
    • Tschanz, J.1
  • 8
    • 33748584309 scopus 로고    scopus 로고
    • Mathematically Assisted Adaptive Body Bias (ABB) for Temperature Compensation in Gigascale LSI Systems
    • Jan
    • S. V. Kumar, C. H. Kim, and S. S. Sapatnekar. Mathematically Assisted Adaptive Body Bias (ABB) for Temperature Compensation in Gigascale LSI Systems . In Proc. ASP DAC, pp. 559-564, Jan. 2006.
    • (2006) Proc. ASP DAC , pp. 559-564
    • Kumar, S.V.1    Kim, C.H.2    Sapatnekar, S.S.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.