Standardization of a shear test method for lead-free solder paste chip joints

Journal of Materials Science

Volumn 42, Issue 17, 2007, Pages 7451-7456

  Choi, Jai Kyoung ^a   Park, Jai Hyun ^b   Ahn, Yong Sik ^a  

^a Pukyong National University   (South Korea)

^b Research Institute of Industrial Science and Technology (RIST)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

FRACTURE MECHANICS; SCANNING ELECTRON MICROSCOPY; SHEAR STRESS; SOLDERED JOINTS; STATISTICAL METHODS;

PB-BASED SOLDER; SHEAR CONDITIONS; SHEAR TEST METHOD;

SOLDERING ALLOYS;

EID: 34547287183     PISSN: 00222461     EISSN: 15734803     Source Type: Journal    
DOI: 10.1007/s10853-007-1627-5     Document Type: Article

References (9)

1. Korean Agency for Technology and Standards (2003) Sn-Ag-Cu lead-free solder paste, RS D 0026
2. Japanese Standards Association (2003) Test methods for lead-free solders - Part 7. Methods for shear strength of solder joints on chip components, JIS Z 3198-7
3. Kim JW, Yoon JW, Jung SB (2004) Mater Sci Forum 449:897
4. Nadai A (1950) In: Theory of flow and fracture of solids, McGraw-Hill, Inc., New York, p 535
5. Koo JM, Kim DU, Jung SB (2002) IWC-Korea, p 463
6. Kim JW, Park SK, Jung SB (2006) J Kor Inst Met & Mater 44(3):199
7. JEDEC Solid State Technology Association: JESD22-B117 (2000) p 199
8. Kim HI, Han SW, Kim JM, Choi MK, Shin YE (2005) J KWS 23(4):344
9. Coyle RJ, Solan PP (2000) In: Proceedings of the 26th IEEE International Electronics Manufacturing Symposium. Santa Clara, CA, p 168