Materials and thermal stability of tantalum carbide layers for metal gate applications

ICSICT-2006: 2006 8th International Conference on Solid-State and Integrated Circuit Technology, Proceedings

Volumn , Issue , 2006, Pages 418-420

  Zhao, C ^a   Schram, T ^a   Van Ammel, A ^a   Conard, T ^a   De Gendt, S ^a   Yamada, N ^b  

^a IMEC   (Belgium)

^b Canon ANELVA Technix Corporation   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

HIGH TEMPERATURE EFFECTS; PHASE COMPOSITION; PHYSICAL VAPOR DEPOSITION; TANTALUM CARBIDE; THERMODYNAMIC STABILITY; X RAY DIFFRACTION ANALYSIS;

METAL GATE APPLICATIONS; TANTALUM CARBIDE LAYERS;

GATE DIELECTRICS;

EID: 34547279346     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICSICT.2006.306266     Document Type: Conference Paper

References (4)

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