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Volumn 59, Issue 1, 2007, Pages 740-744

UV laser drilling of SiC for semiconductor device fabrication

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EID: 34547278216     PISSN: 17426588     EISSN: 17426596     Source Type: Conference Proceeding    
DOI: 10.1088/1742-6596/59/1/158     Document Type: Article
Times cited : (16)

References (22)
  • 3
    • 0032403655 scopus 로고    scopus 로고
    • Tönshoff HK, von Alvensleben F, Graumann C, Willmann G 1998 Proc. SPIE Opto-Contact: Workshop on Technology Transfers, Start-Up Opportunities and Strategic Alliances. (Quebec, Canada, 13-14 Jul 1998) ((SPIE-Int. Soc. Opt. Eng) vol 3414) p 51-9
    • (1998) , pp. 51-59
    • Tönshoff, H.K.1    Von Alvensleben, F.2    Graumann, C.3    Willmann, G.4
  • 6
    • 0035049596 scopus 로고    scopus 로고
    • Sugioka K 2001 Proc. SPIE Laser-Assisted Microtechnology 2000. (St. Petersburg-Pushkin, Russia, 23-25 Aug 2000) ((SPIE-Int. Soc. Opt. Eng) vol 4157) p 149-57
    • (2001) , pp. 149-157
    • Sugioka, K.1
  • 15
    • 0344549114 scopus 로고    scopus 로고
    • Ashkenasi D, Binder A, Jaber H, Kern H, Mueller N, Ziegert A 2003 Proc. SPIE Photon Processing in Microelectronics and Photonics II. (San Jose, CA, USA, 27-30 Jan 2003) ((SPIE-Int. Soc. Opt. Eng) vol 4977) p 542-54
    • (2003) , pp. 542-554
    • Ashkenasi, D.1    Binder, A.2    Jaber, H.3    Kern, H.4    Mueller, N.5    Ziegert, A.6
  • 17
    • 34547280016 scopus 로고    scopus 로고
    • Krüger O, Schöne G, Liero A, Würfl J, Tränkle G 2005 Proc. 3rd Int. WLT-Conf. Lasers in Manufacturing 2005 (Munich, Germany, 13 Jun 2005-16 Jun 2005) ed E Beyer, F Dausinger et al (Stuttgart, Germany: German Sci. Laser Soc) p 663-7
    • (2005) , pp. 663-667
    • Krüger, O.1    Schöne, G.2    Liero, A.3    Würfl, J.4    Tränkle, G.5


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.