High Speed and High Precision Solder Bump Inspection Method Using X-ray Fluoroscopy

IEEJ Transactions on Industry Applications

Volumn 125, Issue 6, 2005, Pages 652-658

  Teramoto, Atsushi ^a   Murakoshi, Takayuki ^a   Horiba, Isao ^a  

^a Nagoya Electric Works Co Ltd   (Japan)

Author keywords

bump; fluctuation; inspection; solder; X ray

Indexed keywords

EID: 34547255032     PISSN: 09136339     EISSN: 13488163     Source Type: Journal    
DOI: 10.1541/ieejias.125.652     Document Type: Article

References (0)