Etch induced sidewall damage evaluation in porous low- k methyl silsesquioxane films

Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films

Volumn 25, Issue 4, 2007, Pages 986-989

  Kong, Byungkook ^a,b   Choi, Tom ^b   Sirard, Stephen ^b   Kim, D J ^a   Lee, N E ^a  

^a Sungkyunkwan University   (South Korea)

^b LAM RESEARCH CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FILMS; PLASMA ETCHING; PRESSURE EFFECTS;

CARBON DEPLETION; DAMAGE EVALUATION; SILANOL FORMATION; SILSESQUIOXANE FILMS;

POROUS MATERIALS;

EID: 34547242239     PISSN: 07342101     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.2717192     Document Type: Article

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