Study on thermal stability and chemical structure of polyamide blended with small amount of Cu

Kobunshi Ronbunshu

Volumn 64, Issue 6, 2007, Pages 380-386

  Arai, Tsuyoshi ^a   Ueno, Tomonaga ^b   Kajiya, Takafumi ^b   Ishikawa, Tomoyuki ^b   Takeda, Kunihiko ^b  

^a Advanced Nuclear System Research and Development Directorate   (Japan)

^b NAGOYA UNIVERSITY   (Japan)

Author keywords

Chemical structure; Copper; Polyamide; Tensile strength; Thermal stability

Indexed keywords

WATER UPTAKE;

BLENDING; COPPER; DIFFUSION; PYROLYSIS; STRUCTURE (COMPOSITION); TENSILE STRENGTH; THERMAL AGING; THERMODYNAMIC STABILITY;

POLYAMIDES;

COPPER; DIFFUSION; MOLECULAR WEIGHT; POLYMER BLEND; SYNTHETIC POLYAMIDE; TENSILE PROPERTY; THERMAL STABILITY;

EID: 34547105573     PISSN: 03862186     EISSN: None     Source Type: Journal    
DOI: 10.1295/koron.64.380     Document Type: Article

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