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Volumn , Issue , 2004, Pages 147-157

Initial Risk Analysis of Potential Failure Modes

Author keywords

[No Author keywords available]

Indexed keywords

C (PROGRAMMING LANGUAGE); DEGRADATION; DURABILITY; FAILURE MODES; MATERIALS TESTING; RISK ANALYSIS; RISK ASSESSMENT; RISK PERCEPTION;

EID: 34250856294     PISSN: None     EISSN: None     Source Type: Book    
DOI: 10.1016/B978-008044401-7/50013-4     Document Type: Chapter
Times cited : (6)

References (13)
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    • Al-Sheikhly, M.1    Christou, A.2
  • 2
    • 84937650904 scopus 로고
    • Electromigration - A Brief Survey and Some Recent Results
    • April
    • Black J.R. Electromigration - A Brief Survey and Some Recent Results. IEEE Trans. Electron Devices 1969 April, ED-16:338-347.
    • (1969) IEEE Trans. Electron Devices , vol.ED-16 , pp. 338-347
    • Black, J.R.1
  • 3
    • 85031258310 scopus 로고
    • Assessment of Service Life by Accelerated Testing - Methodology for Qualification of Rust Protective Paint Systems
    • ISBN 91-7848-592-4 (Swedish), SE-50115 Bors, Sweden
    • Carlsson B., Berglund hman A., Jutengren K. Assessment of Service Life by Accelerated Testing - Methodology for Qualification of Rust Protective Paint Systems. SP Swedish National Testing and Research Institute, SP-Report 1995:65 1995, ISBN 91-7848-592-4 (Swedish), SE-50115 Bors, Sweden.
    • (1995) SP Swedish National Testing and Research Institute, SP-Report 1995:65
    • Carlsson, B.1    Berglundhman, A.2    Jutengren, K.3
  • 4
    • 0242488446 scopus 로고
    • Accelerated Life Testing of Solar Energy Materials - Case Study of Some Selective Solar Absorber Coatings for DHW systems, International Energy Agency, Solar Heating and Cooling Programme Task X: Solar Materials Research and Development, Technical Report
    • SE-50115 Bors, Sweden
    • Carlsson B., Frei U., Köhl M., Möller K. Accelerated Life Testing of Solar Energy Materials - Case Study of Some Selective Solar Absorber Coatings for DHW systems, International Energy Agency, Solar Heating and Cooling Programme Task X: Solar Materials Research and Development, Technical Report. SP- Report 1994:13 1994, SE-50115 Bors, Sweden.
    • (1994) SP- Report 1994:13
    • Carlsson, B.1    Frei, U.2    Köhl, M.3    Möller, K.4
  • 5
    • 0026374740 scopus 로고
    • Material Failure-mechanisms and Damage Models
    • Dasgupta A., Pecht M. Material Failure-mechanisms and Damage Models. IEEE Trans. Reliability 1991, 40:531-536.
    • (1991) IEEE Trans. Reliability , vol.40 , pp. 531-536
    • Dasgupta, A.1    Pecht, M.2
  • 6
    • 0020297175 scopus 로고
    • DiGiacomo Metal Migration (Ag, Cu, Pb) in Encapsulated Modules and Time-to-fail Model as a Function of the Environment and Package Properties
    • DiGiacomo Metal Migration (Ag, Cu, Pb) in Encapsulated Modules and Time-to-fail Model as a Function of the Environment and Package Properties. IEEE Proc. Int'l Reliability Physics Symp. 1982, 27-33.
    • (1982) IEEE Proc. Int'l Reliability Physics Symp. , pp. 27-33
  • 7
    • 84902638359 scopus 로고
    • Failure More and Effect Analysis Instruction manual from Volvo Car Corporation
    • Stockholm, Sweden, Ord & Form AB, C. Britsman, . Lönnqvist, S.O. Ottosson (Eds.)
    • Failure More and Effect Analysis Instruction manual from Volvo Car Corporation. Failure Mode and Effect Analysis 1993, Stockholm, Sweden, Ord & Form AB. C. Britsman, . Lönnqvist, S.O. Ottosson (Eds.).
    • (1993) Failure Mode and Effect Analysis
  • 8
    • 85031267993 scopus 로고
    • Analysis Techniques for System Reliability - Procedure for Failure Mode and Effect Analysis (FMEA)
    • CH-1211 Geneva 20, Switzerland
    • Analysis Techniques for System Reliability - Procedure for Failure Mode and Effect Analysis (FMEA). IEC Standard, Publ. No. 812 1985, CH-1211 Geneva 20, Switzerland.
    • (1985) IEC Standard, Publ. No. 812
  • 9
    • 0029487755 scopus 로고
    • Electrolytic Models for Metallic Electromigration Failure Mechanisms
    • December
    • Krumbein S.J. Electrolytic Models for Metallic Electromigration Failure Mechanisms. IEEE Trans. Reliability 1995 December, 44:539-549.
    • (1995) IEEE Trans. Reliability , vol.44 , pp. 539-549
    • Krumbein, S.J.1
  • 10
    • 0028384233 scopus 로고
    • Failure-mechanism Models for Material Aging due to Interdiffusion
    • March
    • Li, Dasgupta A. Failure-mechanism Models for Material Aging due to Interdiffusion. EEE Trans. Reliability 1994, March, 43:2-10.
    • (1994) EEE Trans. Reliability , vol.43 , pp. 2-10
    • Li, D.A.1
  • 11
    • 0027577979 scopus 로고
    • Evaluating the Large Electromigration Resistance of Copper Interconnects Employing a Newly Developed Accelerated Life-test Method
    • April
    • Nitta T., et al. Evaluating the Large Electromigration Resistance of Copper Interconnects Employing a Newly Developed Accelerated Life-test Method. J. Electrochem. Soc. 1993 April, 140:1131-1137.
    • (1993) J. Electrochem. Soc. , vol.140 , pp. 1131-1137
    • Nitta, T.1
  • 13
    • 0028448170 scopus 로고
    • Failure-mechanism Models for Electromigration
    • June
    • Young D., Christou A. Failure-mechanism Models for Electromigration. IEEE Trans. Reliability 1994, June, 43:186-192.
    • (1994) IEEE Trans. Reliability , vol.43 , pp. 186-192
    • Young, D.1    Christou, A.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.