Novel CMOS compatible frontside micromachining of integrated thermoelectric sensors

21st IEEE Convention of the Electrical and Electronic Engineers in Israel, Proceedings

Volumn , Issue , 2000, Pages 417-420

  Socher, E ^a   Bochobza Degani, O ^a   Nemirovsky, Y ^a  

^a TECHNION ISRAEL INSTITUTE OF TECHNOLOGY   (Israel)

Author keywords

[No Author keywords available]

Indexed keywords

CMOS INTEGRATED CIRCUITS; MICROMACHINING; PIXELS;

CMOS COMPATIBLE; MEASURED RESULTS; SPIRAL STRUCTURES; STANDARD CMOS PROCESS; SUSPENDED STRUCTURE; THERMOELECTRIC SENSORS;

COMPOSITE MICROMECHANICS;

EID: 34250790995     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EEEI.2000.924455     Document Type: Conference Paper

References (4)

1. H. Baltes, O. Paul and O. Brand, Proc. IEEE, August 1998, pp. 1660-1678.
2. E. Socher, O. Degani and Y. Nemirovsky, Sensors and Actuators A 71 (1998) 107-115.
3. E. Socher, O. Bochobza-Degani and Y. Nemirovsky, Transducers'99, Sendai, Japan, 7-10 June 1999, pp. 406-409.
4. E. Socher, O. Bochobza-Degani and Y. Nemirovsky, IEEE J. MicroElectroMechnical Systems, to be published (March 2000).