Temperature field and wear prediction for UHMWPE acetabular cup with assumed rectangular surface texture

Materials and Design

Volumn 28, Issue 9, 2007, Pages 2402-2416

  Dong, Guang Neng ^a,b   Hua, Meng ^b   Li, Jian ^c   Chuah, Kong Bieng ^b  

^a XI'AN JIAOTONG UNIVERSITY   (China)

^b CITY UNIVERSITY OF HONG KONG   (Hong Kong)

^c WUHAN RESEARCH INSTITUTE OF MATERIALS PROTECTION   (China)

Author keywords

Artificial joint; Creep; Simulation; Temperature rise; Thermoplastics; UHMWPE; Wear

Indexed keywords

COMPUTER SIMULATION; CREEP; TEMPERATURE DISTRIBUTION; TEXTURES; THERMAL EFFECTS; THERMOPLASTICS; TRIBOLOGY; VISCOELASTICITY; WEAR OF MATERIALS;

SURFACE TEMPERATURE; SURFACE TEXTURE;

ULTRAHIGH MOLECULAR WEIGHT POLYETHYLENES;

COMPUTER SIMULATION; CREEP; TEMPERATURE DISTRIBUTION; TEXTURES; THERMAL EFFECTS; THERMOPLASTICS; TRIBOLOGY; ULTRAHIGH MOLECULAR WEIGHT POLYETHYLENES; VISCOELASTICITY; WEAR OF MATERIALS;

EID: 34250769582     PISSN: 02613069     EISSN: 18734197     Source Type: Journal    
DOI: 10.1016/j.matdes.2006.09.015     Document Type: Article

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