Numerical simulation of temperature field on complicated parts during plasma deposition dieless manufacturing

Hanjie Xuebao/Transactions of the China Welding Institution

Volumn 28, Issue 5, 2007, Pages 49-52

  Wang, Guilan ^a   Wu, Shengchuan ^a   Zhang, Haiou ^a  

^a HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

Author keywords

Finite element analysis; Hot crackability; Plasma deposition dieless manufacturing; Symmetrical jump scanned paths; Temperature field

Indexed keywords

BOUNDARY CONDITIONS; COMPUTATIONAL EFFICIENCY; COMPUTER SIMULATION; FINITE ELEMENT METHOD; TEMPERATURE DISTRIBUTION;

FINITE ELEMENT ANALYSIS; HOT CRACKABILITY; PLASMA DEPOSITION DIELESS MANUFACTURING; SYMMETRICAL JUMP SCANNED PATHS; TEMPERATURE FIELD;

PLASMA DEPOSITION;

EID: 34250752946     PISSN: 0253360X     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (6)