Liquid-liquid interfacial tension in ternary monotectic alloys Al-Bi-Cu and Al-Bi-Si

International Journal of Thermophysics

Volumn 28, Issue 2, 2007, Pages 723-731

  Kaban, I ^a   Hoyer, W ^a   Kehr, M ^a  

^a CHEMNITZ UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

Aluminum; Bismuth; Copper; Immiscibility; Interfacial tension; Silicon

Indexed keywords

LIQUID-LIQUID INTERFACIAL TENSION; TEMPERATURE DEPENDENCES; TENSIOMETRIC TECHNIQUE; TERNARY MONOTECTIC ALLOYS;

ALUMINUM; BISMUTH; COPPER; SILICON; SOLUBILITY; SURFACE TENSION;

TERNARY ALLOYS;

EID: 34250647831     PISSN: 0195928X     EISSN: None     Source Type: Journal    
DOI: 10.1007/s10765-007-0184-0     Document Type: Conference Paper

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