Novel T shape structure PCM and electrical-thermal characteristics

International Symposium on VLSI Technology, Systems, and Applications, Proceedings

Volumn , Issue , 2006, Pages 40-41

  Wang, W H ^a   Chao, D S ^a   Chen, Y C ^a   Lee, C M ^a   Hsu, H H ^a   Chuo, Y ^a   Tseng, M H ^a   Lee, M H ^a   Chen, W S ^a   Kao, M J ^a   Tsai, M J ^a  

^a INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC RESISTANCE; INTERFACIAL ENERGY; OPTIMIZATION; POWER CONTROL; PULSE CODE MODULATION;

CORRESPONDING THICKNESSES; DISTRIBUTION CAPABILITIES;

ELECTRIC VARIABLES MEASUREMENT;

EID: 34250330814     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/VTSA.2006.251057     Document Type: Conference Paper

References (6)

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3. H. Horii, et al., Symposium on VLSI Technology, 2003.
4. F. Pellizzer, et al., Symposium on VLSI Technology, 2004
5. Martijn Lankhorst, et al, Nature Material p.347 April 2005
6. S. J. Ahn, et al., IEEE, 2004.