A study of vacuum diffusion bonding and interface structure of Ti/Al dissimilar materials

Cailiao Kexue yu Gongyi/Material Science and Technology

Volumn 15, Issue 2, 2007, Pages 206-210

  Li, Ya Jiang ^a,b   Gerasimov, S A ^b   Wang, Juan ^a   Ma, Hai Jun ^a   Ren, Jiang Wei ^a  

^a SHANDONG UNIVERSITY   (China)

^b BAUMAN MOSCOW STATE TECHNICAL UNIVERSITY   (Russian Federation)

Author keywords

Diffusion bonding; Interface; Intermetallic; Microstructure

Indexed keywords

ALUMINUM; DISSIMILAR MATERIALS; INTERFACES (MATERIALS); INTERMETALLICS; MICROHARDNESS; MICROSTRUCTURE; SCANNING ELECTRON MICROSCOPY; TITANIUM SHEET; VACUUM; X RAY DIFFRACTION ANALYSIS;

AL SIDE INTERFACE; DIFFUSION TRANSITION ZONE; TI/AL DIFFUSION JOINT; TI/AL DISSIMILAR MATERIALS; VACUUM DIFFUSION BONDING;

DIFFUSION BONDING;

EID: 34250002755     PISSN: 10050299     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (10)

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