Effect of cooling rate on the solidification behavior of AC AlSi7Cu2 alloy

Journal of Materials Processing Technology

Volumn 191, Issue 1-3, 2007, Pages 317-320

  Dobrzanski L A ^a   Maniara, R ^a   Sokolowski J ^b   Kasprzak, W ^a  

^a SILESIAN UNIVERSITY OF TECHNOLOGY   (Poland)

^b Light Metals Casting Technology (LMCT) Group   (Canada)

Author keywords

Aluminum alloys; Eutectic nucleation temperature; Silicon modification level; Thermal characteristics; Undercooling

Indexed keywords

COOLING; CRYSTALLIZATION; DENDRITES (METALLOGRAPHY); EUTECTICS; NUCLEATION; PRECIPITATION (CHEMICAL); SOLIDIFICATION; CERIUM ALLOYS; CESIUM; CHEMICAL ANALYSIS; CHEMICAL MODIFICATION; LASERS; PHASE DIAGRAMS; SILICON; UNDERCOOLING;

COOLING CURVES; EUTECTIC NUCLEATION TEMPERATURES; SILICON MODIFICATION LEVEL; THERMAL CHARACTERISTICS;

ALUMINUM ALLOYS;

ALUMINUM DENDRITE; CRYSTALLIZATION CURVES; NUCLEATION TEMPERATURE; SOLIDIFICATION BEHAVIORS; SOLIDIFICATION PROCESS; SOLIDIFICATION RATE; SOLIDUS TEMPERATURE; THERMAL CHARACTERISTICS;

EID: 34249949039     PISSN: 09240136     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jmatprotec.2007.03.099     Document Type: Article

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