Packaging for a sensor platform embedded in concrete

Materials Research Society Symposium Proceedings

Volumn 682, Issue , 2001, Pages 73-78

  Cain, Russell Paul ^a   Carkhuff, Bliss G ^a   Srinivasan, R ^a   Grossman, Kenneth R ^a   Weiskopf, Frank ^a  

^a JOHNS HOPKINS UNIVERSITY APPLIED PHYSICS LABORATORY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BRIDGE DECKS; CONCRETE CONSTRUCTION; CORROSIVE EFFECTS; EMBEDDED SYSTEMS; MAINTENANCE; RISK ANALYSIS; SENSORS; THERMAL SHOCK; THERMAL STRESS;

DISTRIBUTED SENSORS; EMBEDDED SENSORS; RELIABILITY TEST;

ELECTRONICS PACKAGING;

EID: 34249907553     PISSN: 02729172     EISSN: None     Source Type: Journal    
DOI: 10.1557/proc-682-n3.9     Document Type: Article

References (0)