Integration of materials and device research enabled by wafer bonding and layer transfer

Materials Research Society Symposium Proceedings

Volumn 681, Issue , 2001, Pages 1-23

  Tong, Q Y ^a  

^a RTI INTERNATIONAL   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CMOS INTEGRATED CIRCUITS; HETEROJUNCTION BIPOLAR TRANSISTORS; HYDROPHILICITY; MICROPROCESSOR CHIPS; THREE DIMENSIONAL; VLSI CIRCUITS;

HYDROPHOBIC SILICON; INTEGRATED MATERIALS; LAYER TRANSFER; LOW TEMPERATURE BONDING;

WAFER BONDING;

EID: 34249898064     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-681-i1.2     Document Type: Conference Paper

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