Partial nickel plating using organic gel electrolyte

Electrochimica Acta

Volumn 52, Issue 23, 2007, Pages 6421-6426

  Itagaki, Masayuki ^a   Shitanda, Isao ^a   Nakamura, Wataru ^a   Watanabe, Kunihiro ^a  

^a TOKYO UNIVERSITY OF SCIENCE   (Japan)

Author keywords

Electrochemical impedance; Gel electrolyte; Nickel plating; Organic solvent; Partial plating

Indexed keywords

COPPER; ELECTROCHEMICAL IMPEDANCE SPECTROSCOPY; GELS; NICKEL PLATING; ORGANIC SOLVENTS; POLARIZATION; SUBSTRATES;

GEL ELECTROLYTES; GELLING AGENTS; PARTIAL PLATING; POLYVINYLCHLORIDES; SURFACE PATTERNING;

ELECTROLYTES;

EID: 34249893400     PISSN: 00134686     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.electacta.2007.04.051     Document Type: Article

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