Factors influencing the dressing rate of chemical mechanical polishing pad conditioning

International Journal of Advanced Manufacturing Technology

Volumn 33, Issue 7-8, 2007, Pages 720-724

  Tso, Pei Lum ^a   Ho, Shuo Young ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

Chemical mechanical polishing; Dressing rate; Pad conditioning; Polishing pad

Indexed keywords

COST EFFECTIVENESS; GLAZES; MAINTAINABILITY; PROCESS CONTROL; SURFACE PROPERTIES;

DRESSING RATES; PAD CONDITIONING PROCESSES; POLISHING PADS;

CHEMICAL MECHANICAL POLISHING;

EID: 34249872998     PISSN: 02683768     EISSN: 14333015     Source Type: Journal    
DOI: 10.1007/s00170-006-0501-y     Document Type: Article

References (3)

1. 2 films. Thin Solid Films 270:601-606
2. Kim H-Y, Park J-H, Jeong H-D (2001) A study of the abrasive pad for CMP. In: Advances in Abrasive Technology IV. Department of Precision Mechanical Engineering, Pusan National University, South Korea, pp 263-270
3. Sung J, Pai YL (2000) CMP pad dresser: a diamond grid solution. In: Advances in Abrasive Technology III. The Society of Grinding Engineers, pp 189-196