Radio frequency thermal plasma treatment for size reduction and spheroidization of glass powders used in ceramic electronic devices

Journal of the American Ceramic Society

Volumn 90, Issue 6, 2007, Pages 1717-1722

  Seo, Jun Ho ^a   Kim, Dong Uk ^a   Nam, Jun Seok ^b   Hong, Sang Hee ^b   Sohn, Sung Bum ^c   Song, Soon Mo ^c  

^a Plasnix Co Ltd   (South Korea)

^b Seoul National University   (South Korea)

^c Samsung Electro Mechanics   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

EVAPORATION; HIGH TEMPERATURE APPLICATIONS; MELTING; QUENCHING; SCANNING ELECTRON MICROSCOPY; SINTERING;

CERAMIC ELECTRONIC DEVICES; RADIO FREQUENCY; SPHEROIDIZATION; THERMAL PLASMA TREATMENT;

GLASS;

EID: 34249856289     PISSN: 00027820     EISSN: 15512916     Source Type: Journal    
DOI: 10.1111/j.1551-2916.2007.01645.x     Document Type: Article

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