A novel packaging approach for RF MEMS switching functions on alumina substrate

Microsystem Technologies

Volumn 13, Issue 11-12, 2007, Pages 1457-1461

  El Khatib, Mohamad ^a   Pothier, Arnaud ^a   Crunteanu, Aurelian ^a   Blondy, Pierre ^a  

^a Centre National de la Recherche Scientifique   (France)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINA; ENCAPSULATION; MEMS; SUBSTRATES; SWITCHING FUNCTIONS; WSI CIRCUITS;

HERMETICITY; MEMS FABRICATION TECHNOLOGY; RF SIGNAL TRANSMISSION; WAFER SCALE PACKAGE;

ELECTRONICS PACKAGING;

EID: 34249824625     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00542-006-0375-9     Document Type: Conference Paper

References (8)

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8. Woode RA, Ivanov EN, Tobar ME, Blair DO (1994) Measurement of dielectric loss tangent of alumina at microwave frequencies and room temperature. Electron Lett 30:25