An electromechanical impedance model of a piezoceramic transducer-structure in the presence of thick adhesive bonding

Smart Materials and Structures

Volumn 16, Issue 3, 2007, Pages 673-686

  Madhav, Annamdas Venu Gopal ^a   Soh, Chee Kiong ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; ELECTRIC IMPEDANCE; ELECTROMECHANICAL DEVICES; MATHEMATICAL MODELS; STRUCTURAL HEALTH MONITORING; THREE DIMENSIONAL;

ADHESIVE BONDING; ELECTROMECHANICAL IMPEDANCE; ENGINEERING STRUCTURES; PIEZOCERAMIC (PZT) TRANSDUCERS;

PIEZOELECTRIC TRANSDUCERS;

EID: 34249275307     PISSN: 09641726     EISSN: 1361665X     Source Type: Journal    
DOI: 10.1088/0964-1726/16/3/014     Document Type: Article

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