Thin-film thermoelectric cooler: Thermodynamic modelling and its temperature-entropy flux formulation

Proceedings of the Institution of Mechanical Engineers, Part E: Journal of Process Mechanical Engineering

Volumn 221, Issue 1, 2007, Pages 33-46

  Chakraborty, A ^a   Saha, B B ^a   Koyama, S ^a   Ng, K C ^b  

^a KYUSHU UNIVERSITY   (Japan)

^b NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

Author keywords

And phonons; Boltzmann transport; Collisions of electrons; Entropy generation; Holes; T s diagrams; Thermodynamic modelling; Thin films thermoelectrics

Indexed keywords

BOLTZMANN EQUATION; CURRENT DENSITY; ELECTRONS; ENTROPY; GIBBS FREE ENERGY; HEAT LOSSES; HEAT TRANSFER; HOLE CONCENTRATION; PHONONS; THERMOELECTRIC REFRIGERATION; TRANSPORT PROPERTIES;

ELECTRON-HOLE COLLISIONS; TEMPERATURE-ENTROPY DIAGRAM; THERMOELECTRIC COOLER;

COOLING SYSTEMS;

BOLTZMANN EQUATION; COOLING SYSTEMS; CURRENT DENSITY; ELECTRONS; ENTROPY; GIBBS FREE ENERGY; HEAT LOSSES; HEAT TRANSFER; HOLE CONCENTRATION; PHONONS; THERMOELECTRIC REFRIGERATION; TRANSPORT PROPERTIES;

EID: 34248994159     PISSN: 09544089     EISSN: None     Source Type: Journal    
DOI: 10.1243/0954408JPME92     Document Type: Article

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