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Volumn 51, Issue 3, 2006, Pages
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Surface tension and density of Cu-Ag, Cu-In and Ag-In alloys
a a a b |
Author keywords
Ag In systems; Cu Ag; Cu In; Density; Lead free solders; Surface tension
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Indexed keywords
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EID: 34248679318
PISSN: 17333490
EISSN: None
Source Type: Journal
DOI: None Document Type: Article |
Times cited : (35)
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References (28)
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