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Volumn 51, Issue 3, 2006, Pages

Surface tension and density of Cu-Ag, Cu-In and Ag-In alloys

Author keywords

Ag In systems; Cu Ag; Cu In; Density; Lead free solders; Surface tension

Indexed keywords


EID: 34248679318     PISSN: 17333490     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article
Times cited : (35)

References (28)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.