Tensile and indentation creep behavior of Mg-5% Sn and Mg-5% Sn-2% Di alloys

Materials Science and Engineering: A

Volumn 464, Issue 1-2, 2007, Pages 124-128

  Liu, Hongmei ^a   Chen, Yungui ^a   Tang, Yongbai ^a   Wei, Shanghai ^a   Niu, Gao ^a  

^a SICHUAN UNIVERSITY   (China)

Author keywords

Didymium; Indentation creep; Mg Sn alloy; Microstructure; Tensile

Indexed keywords

ADDITION REACTIONS; CREEP RESISTANCE; GRAIN BOUNDARIES; INDENTATION; METALLOGRAPHIC MICROSTRUCTURE; TENSILE PROPERTIES;

DIDYMIUM; INDENTATION CREEP;

MAGNESIUM ALLOYS;

ADDITION REACTIONS; CREEP RESISTANCE; GRAIN BOUNDARIES; INDENTATION; MAGNESIUM ALLOYS; METALLOGRAPHIC MICROSTRUCTURE; TENSILE PROPERTIES;

EID: 34248592196     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2007.02.061     Document Type: Article

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