Assembly and integration of thin bare die using laser direct-write

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 6458, Issue , 2007, Pages

  Piqué, Alberto ^a   Charipar, Nicholas A ^a   Auyeung, Ray C Y ^a   Kim, Heungsoo ^a   Mathews, Scott A ^b  

^a NAVAL RESEARCH LABORATORY   (United States)

^b Catholic University of America ^*  (United States)

Author keywords

Laser die transfer; Laser direct write; Laser embedding; Laser assisted microelectronics assembly; Laser induced forward transfer

Indexed keywords

INTEGRATION; MICROELECTRONICS; PHOTONICS; SUBSTRATES;

LASER DIE TRANSFER; LASER DIRECT-WRITE; LASER-ASSISTED MICROELECTRONICS ASSEMBLY; LASER-BASED DIRECT-WRITE (LDW); LASER-INDUCED FORWARD-TRANSFER; SEMICONDUCTOR BARE DIE;

DIES;

EID: 34248402516     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.706950     Document Type: Conference Paper

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