Fabrication of sub-micrometer photomask linewidth standards

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 3236, Issue , 1997, Pages 176-186

  Tarascon Auriol, Régine ^a   Norbert Talene ^a   Sadran, Dominique ^a   Doyle, Gary ^a   Nunn, John ^b  

^a DUPONT COMPANY   (United States)

^b NATIONAL PHYSICAL LABORATORY   (United Kingdom)

Author keywords

Photomask; SAL605; Standard

Indexed keywords

ELECTRON BEAM LITHOGRAPHY; FITS AND TOLERANCES; MANUFACTURE; PHOTORESISTORS; PHOTORESISTS; PLASMA ETCHING; STANDARDS; THICKNESS MEASUREMENT;

BINARY MASKS; CHEMICALLY AMPLIFIED RESISTS; DRY ETCH; ETCHING TOOLS; EXPOSURE TOOLS; FEATURE SIZINGS; FINAL PRODUCTS; HUMIDITY LEVELS; LINEWIDTH STANDARDS; METROLOGY DATUMS; METROLOGY TOOLS; NEGATIVE TONE RESISTS; PATTERN WRITERS; POST EXPOSURES; PRODUCTION MODES; RESIST SENSITIVITIES; SAL605; SPOT SIZES; TIGHT TOLERANCES;

PHOTOMASKS;

EID: 34248194048     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.301187     Document Type: Conference Paper

References (3)

1. L. Blum, M. Perkins and H-Y Liu, J. Vac. Sci. Technol. B 6 (6), Nov/Dec 1988, p 2280
2. T. Fedynyshyn, M. Cronin and J. Thackeray, Proc. SPIE, 1924, 63 (1993)
3. J. Potzick and J. Nunn, Proc. SPIE, 2725-08, (1996)