A sheathless poly(methyl methacrylate) chip-CE/MS interface fabricated using a wire-assisted epoxy-fixing method

Electrophoresis

Volumn 28, Issue 8, 2007, Pages 1265-1273

  Li, Fu An ^a   Wang, Chih Hung ^a   Her, Guor Rong ^a  

^a NATIONAL TAIWAN UNIVERSITY   (Taiwan)

Author keywords

CE; Electrospray; Microchip; MS

Indexed keywords

ELECTRIC CONNECTORS; EPOXY RESINS; ESTERS; FUSED SILICA; MICROPROCESSOR CHIPS;

CE; ELECTRICAL CONNECTION; ELECTROSPRAYS; EPOXY; FIXING METHODS; MICROCHIP; MS; MS- INTERFACE; POLY(METHYL METHACRYLATE); POLY-METHYL METHACRYLATES;

WIRE;

EPOXY RESIN; PEPTIDE; POLY(METHYL METHACRYLATE); RUBBER; SILICON DIOXIDE;

ARTICLE; CAPILLARY ELECTROPHORESIS; CONTROLLED STUDY; DEVICE; ELECTROOSMOSIS; FLOW MEASUREMENT; MASS SPECTROMETRY; MICROCHIP ANALYSIS;

EID: 34248150347     PISSN: 01730835     EISSN: 15222683     Source Type: Journal    
DOI: 10.1002/elps.200600552     Document Type: Article

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