Cost-effective manufacturing of aluminium silicon carbide (AlSiC) electronic packages

Proceedings - International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces

Volumn , Issue , 1999, Pages 118-124

  Occhionero, M A ^a   Hay, R A ^a   Adams, R W ^a   Fennessy, K P ^a  

^a Ceramics Process Systems   (United States)

Author keywords

CTE; Electronic Packaging Material; Lightweight; Thermal Conductivity; Thermal Management

Indexed keywords

ALUMINUM; CERAMIC MATERIALS; COST EFFECTIVENESS; COSTS; ELECTRONICS PACKAGING; INTERFACES (MATERIALS); MANUFACTURE; METALLIC MATRIX COMPOSITES; MICROELECTRONICS; PACKAGING MATERIALS; PRODUCT DESIGN; SEALS; SILICON CARBIDE; SILICON COMPOUNDS; TEMPERATURE CONTROL; THERMAL CONDUCTIVITY; THERMAL EXPANSION; THERMAL VARIABLES CONTROL;

ALUMINUM SILICON CARBIDE; ELECTRONIC PACKAGING MATERIAL; HIGH THERMAL CONDUCTIVITY; HIGH-PERFORMANCE PACKAGING; LIGHTWEIGHT; MANUFACTURING PROCESS; PROCESSING TECHNOLOGIES; WEIGHT-SENSITIVE APPLICATIONS;

ALUMINUM COMPOUNDS;

EID: 34247881598     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISAPM.1999.757298     Document Type: Conference Paper

References (9)

1. B.E. Novich, R.W. Adams, and M.A. Occhionero, "Low-Cost MCM-D Cavity Substrates for Packaging High Density Si and GaAs Devices, " Proceedings of the 10th European Microelectronics Conference, ISHM, Copenhagen, Denmark, May 14-17, 1995, pp 475-481.
2. B.E. Novich, R. W. Adams, and K.P. Fennessy, "Metal Matrix Composites for Single Chip and Multichip Microprocessor Packaging, " Proceedings of the 1995 International Electronics Packaging Conference, IEPS, San Diego CA, September 24-27, 1995.
3. B. Dufour, M. McNulty, and S. Miller, "Microwave Multichip Module Utilizing Aluminum Silicon Carbide With In-Situ Cast Components and High Density Interconnect Technologyj" International Journal of Microcircuits and Electronics Packaging, Vol 20, [3], pp 303-308, IMAPS, (1997).
4. M.A. Occhionero, R. W. Adams, K.P. Fennessy, R.A. Hay, "Aluminum Silicon Carbide (AISiC) for Thermal Management Solutions and Functional Packaging Designs" proceedings of the Annual IMAPS Conference, San Diego CA, October, 1998.
5. R.W. Adams, B.E. Novich, D. Kane, K. Brantferger, R. Oberle and S. Chai, "A Lightweight High Thermal Conductivity Metal Matrix Composite Microwave Module Package For Airbome Applications, " Proceedings of Government Microcircuit Applications Conference (GOMAC), Digest of Papers, Vol. 20, pp 454-456 November 1994.
6. R.W. Adams, M.A. Occhionero, and K.P. Fennessy, "CTE Compatible Thermal Packaging Solutions-Net-Shape Fabricated AlSiC and AlN, " Proceedings of the Third Annual Portable by Design Conference, Electronic Design, March 25-29, 1996, pp 527-536.
7. G.D. Debled, S. Dewar, J. Marous, "A High Power IGBT Module For Severe Operating Environments" in the Proceedings of the 37" Annual PCIM 98 Power Electronics Conference, NOV 7-13, pp 303-310, 1998
8. B.E. Novich and R.W. Adams, "AluminudSilicon Carbide (AlSiC) Metal Matrix Composites For Advanced Packaging Applications, " Proceedings of the 1995 International Electronics Packaging Conference, IEPS, San Diego CA, September 24-27, 1995, pp 220-227.
9. R.W. Adams, B.E. Novich and K.P. Fennessy, "Concurrent Integration TM of AYSiC MMIC Packages, " Proceedings of the 1995 Intemational Symposium on Microelectronics, ISHM, Los Angeles CA, October 1995, pp 36- 41.