Ultrasonic analysis of the degree of cure and cohesive properties of the adhesive in a bond joint

Research in Nondestructive Evaluation

Volumn 18, Issue 2, 2007, Pages 121-138

  Maeva, E Y ^a   Severina, I ^a   Chapman, II ^a  

^a UNIVERSITY OF WINDSOR   (Canada)

Author keywords

Acoustic microscopy; Adhesive cure monitoring; Cohesion strength; Ultrasonic methods

Indexed keywords

ACOUSTIC MICROSCOPES; ADHESIVE JOINTS; CRYSTAL MICROSTRUCTURE; CURING; ELASTIC MODULI; NONDESTRUCTIVE EXAMINATION;

ADHESIVE CURE MONITORING; COHESIVE STRENGTH;

ULTRASONIC TESTING;

EID: 34247592003     PISSN: 09349847     EISSN: 14322110     Source Type: Journal    
DOI: 10.1080/09349840601128747     Document Type: Article

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