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Volumn 55, Issue 10, 2007, Pages 3601-3609

Anomalous debonding behavior of a polymer/inorganic interface

Author keywords

Adhesion; Fatigue; Interfaces; Moisture diffusion; Polymers

Indexed keywords

CYCLIC LOADS; DEBONDING; ETHERS; FATIGUE OF MATERIALS; MOISTURE; POLYMERS;

EID: 34247582320     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.actamat.2007.02.012     Document Type: Article
Times cited : (43)

References (40)
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    • Debonding of interfaces in multilayer interconnect structures
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    • Lane M., Ni W., Dauskardt R.H., Ma Q., Fujimoto H., and Krishna N. Debonding of interfaces in multilayer interconnect structures. In: Murarka S.P., Fraser D.B., Eizenberg M., Tung R., and Madar R. (Eds). Advanced interconnects and contact materials and processes for future integrated circuits. Materials research society symposium proceedings vol. 514 (1998), Materials Research Society, Warrendale, PA 141
    • (1998) Materials research society symposium proceedings , vol.514 , pp. 141
    • Lane, M.1    Ni, W.2    Dauskardt, R.H.3    Ma, Q.4    Fujimoto, H.5    Krishna, N.6
  • 18
    • 0031357479 scopus 로고    scopus 로고
    • Progressive debonding of multilayer interconnect structures
    • Materials reliability in microelectronics VII. Clement J.J., Sanchez Jr. J.D., Krisch K.S., Suo Z., and Keller R.R. (Eds), Materials Research Society, Pittsburgh, PA
    • Lane M., Ware R., Voss S., Ma Q., Fujimoto H., and Dauskardt R.H. Progressive debonding of multilayer interconnect structures. In: Clement J.J., Sanchez Jr. J.D., Krisch K.S., Suo Z., and Keller R.R. (Eds). Materials reliability in microelectronics VII. Materials research society symposium proceedings vol. 473 (1997), Materials Research Society, Pittsburgh, PA 21
    • (1997) Materials research society symposium proceedings , vol.473 , pp. 21
    • Lane, M.1    Ware, R.2    Voss, S.3    Ma, Q.4    Fujimoto, H.5    Dauskardt, R.H.6
  • 23
    • 34247605821 scopus 로고    scopus 로고
    • Sharratt BM, Wang LC, Dauskardt RH. Acta Mater, in preparation.


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.