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Volumn 61, Issue 1, 2007, Pages 1322-1325
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Study and comparison of deposition rates, grain size of Ag and Cu thin films with respect to sputtering parameters, and annealing temperature
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Author keywords
[No Author keywords available]
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Indexed keywords
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EID: 34247536376
PISSN: 17426588
EISSN: 17426596
Source Type: Conference Proceeding
DOI: 10.1088/1742-6596/61/1/261 Document Type: Article |
Times cited : (13)
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References (6)
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